電性量測 & 液晶量測設備

正/負型光阻 & 顯影液

GM 1040

SU-8-negative tone photo-epoxy

for layers from 0.8 to 5 μm
Technical Datasheet

商品說明

SU-8 is an epoxy based, chemically amplified resist system with excellent sensitivity and high aspect ratios. The primary applications are Micro-fabricated Mechanical Structures (MEMS) and other Microsystems.
Examples are sensors, micro-fluidic components, electronic coils, inkjet print head nozzles, multi-chip modules, actuators, LCD spacers and moulds for plastic, stamps for hot embossing and electroplating.
Datasheet parts…
1 / Schematics of the process
2 / Process description
3 / Process parameters
4 / Processing GM1040 – Overview
5 / Typical processes (1μm, 2μm, 3μm, 4μm, 5μm and 10μm)
6 / Troubleshooting
Typical processes (1.0 μm, 2, 3, 4, 5 and 10 μm)

Firstly, the wafer preparation should be as mentioned previously (Oxygen plasma at 500W for min 7min (for some cleaned wafers yet)…). Thickness
0.8μm
1.0μm
2.0μm
3.0μm
4.0μm
5.0μm
Spin coating 40s at …
5000 rpm
3500 rpm
1600 rpm
1100 rpm
800 rpm
650 rpm
Relax. Time*
-
5 min
5 min
10 min
10 min
10 min
Pre-bake
2 min @65°C,
2 min @95°C
5 min @65°C,
5 min @95°C
5 min @65°C,
5 min @95°C
5 min @65°C,
10 min @95°C
5 min @65°C,
15 min @95°C
5 min @65°C,
15 min @95°C
Typical Exposure dose
mJ/cm2
80
100
220
250
280
290
Post-Bake
5 min @65°C,
5 min @95°C
5 min @65°C,
5 min @95°C
5 min @65°C,
5 min @95°C
5 min @65°C,
10 min @95°C
5 min @65°C,
15 min @95°C
5 min @65°C,
15 min @95°C
Delay time
10 min
10 min
10 min
10 min
10 min
10 min
Develop** in PGMEA
10 s
20 s
30 s
40 s
50 s
1 min
Hard Bake
(option)
2h @135°C
2h @135°C
2h @135°C
2h @135°C
2h @135°C
2h @135°C

 
 
 
 
 
 
 
 
 

Part #
Description/ Type
RER-600
SU-8光組顯影液
 
* 容量:1加崙/瓶
 
 
GM1040-1
* Layers for 1-10um 500mL
 
 
GM1040-2
* Layers for 1-10um 1L
 
 
GM1060-1
* Layers for 10-50um 500mL
 
 
GM1060-2
* Layers for 10-50um 1L
 
 
GM1070-1
* Layers for 50-500um 500mL
 
 
GM1070-2
* Layers for 50-500um 1L
 
 
 
 

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